Date: Thu, 17 Feb 2011 15:33:34 -0800 From: Walt Pawley <walt@wump.org> To: Mario Lobo <lobo@bsd.com.br>, freebsd-questions@freebsd.org Subject: Re: CPU heating! Message-ID: <p06240806c9835c16ed43@[10.0.0.10]> In-Reply-To: <201102171953.04717.lobo@bsd.com.br> References: <201102131852.16453.mlobo@digiart.art.br> <201102171953.04717.lobo@bsd.com.br>
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At 7:53 PM -0300 2/17/11, Mario Lobo wrote: >I replaced the thermal grease (as advised here) with a new one but that didn't >change those figures. I've not attempted to keep up with changes in thermal conductivity of heat sink compounds for something like 40 years. About that time, National Semiconductor published a paper about the effectiveness of various means of mounting power semiconductors to heat sinks. As I recall, the only method of obtaining truly efficient heat transfer was soldering the case to the heat sink - clearly not all that practical for many purposes. All of the thermal compounds tested did comparatively poorly, especially when applied too thickly. They worked best when applied just heavily enough to fill voids in the two surfaces being mated. Perhaps things are different today but I have my doubts. If they were, we'd make heat sinks out of thin walled finned copper cans containing the thermal compound.
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